MediaTek Dimensity 6100+ SoC launched: Subsequent to sending off the Dimensity 6020 and 6080 recently, MediaTek has now sent off another SoC in the 6000 series called the MediaTek Dimensity 6100+. Since the 6080 is basically a rebrand of the lower-midrange-level Dimensity 810 5G chipset, we can expect the Dimensity 6100+ to likewise fall in a similar class. The Dimensity 6100+ SoC stands out from its predecessors because of its remarkable power efficiency thanks to its 4nm-based manufacturing process. High frame rates, AI-powered camera technologies, low power consumption, and dependable Sub-6 5G connectivity are all supported.
MediaTek Dimensity 6100+ System on a Chip (SoC) has recently been launched, offering an array of features and capabilities for mobile devices. This powerful SoC is designed to deliver high-performance computing and enhanced gaming experiences. With its advanced AI processing unit, the Dimensity 6100+ enables efficient and intelligent task management, providing users with smooth multitasking capabilities. In addition, this SoC supports 5G connectivity, allowing for fast and reliable internet access. Its integrated graphics processing unit ensures stunning visuals and immersive gaming experiences.
MediaTek Dimensity 6100+ SoC launched
Under the Dimensity 6000 series, MediaTek, a Taiwanese semiconductor manufacturer, has introduced the MediaTek Dimensity 6100+ SoC. This brand-new product from MediaTek features AI-powered camera technologies, high frame rates, vivid displays, and dependable Sub-6 5G connectivity. The Dimensity 6100+ chipset coordinates an improved 5G modem, upholds 10-digit shows, and has strong camera highlights including man-made intelligence bokeh for dazzling pictures and selfies. Allow us to investigate to what more this new SoC offers.
MediaTek Dimensity 6100+ SoC is the latest addition to the MediaTek family of processors, and it brings a host of impressive features and capabilities. This powerful system-on-a-chip is designed to deliver exceptional performance and efficiency for a wide range of devices, including smartphones, tablets, and smart TVs. With its advanced architecture and innovative technologies, the Dimensity 6100+ offers lightning-fast processing speeds, seamless multitasking capabilities, and smooth graphics performance. It also supports 5G connectivity, allowing users to experience ultra-fast download and upload speeds.
MediaTek Dimensity 6100+ SoC launched Details
| Article Name | MediaTek Dimensity 6100+ SoC launched |
| Official link | Click Here |
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| Category | Tech |
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MediaTek Dimensity 6100+ Features
The MediaTek Dimensity 6100+ is a octa-core 6nm processor with six Arm Cortex-A55 efficiency cores and two large Arm Cortex-A76 cores. MediaTek claims that this new chipset features significant enhancements such as support for AI-powered cameras, 10-bit displays, outstanding user experience and graphics processing unit (GPU) performance, and numerous peripheral features. This new chipset has up to 108MP Non-ZSL camera backing and it can likewise catch 2K recordings at 30 fps.
Additionally, UltraSave 3.0+ technology, which reduces 5G power consumption by 20% in comparison to alternatives, is supported by the Dimensity 6100+ chipset. As referred to over, this new SoC moreover has camera features including man-made reasoning bokeh for finding stunning selfies. What’s more, MediaTek has expressed that it is teaming up with Arcsoft to acquaint computer based intelligence variety innovation with standard gadgets so clients can display their inventiveness.
Additionally, the Dimensity 6100+ processor supports high-quality 10-bit displays. It likewise upholds 90Hz to 120Hz casing rates for a smooth client experience. This new chipset likewise has MediaTek HyperEngine 5.0 gaming innovation support which offers smooth execution in game motors and extreme interactivity. The Dimensity 6100+ likewise includes a 3GPP Delivery 16 standard 5G modem. UFS 2.2 storage and LPDDR4x memory are both supported by the chipset. Mali-G57 MC2 can be used with the Dimensity 6100+.
To wrap things up, this new chipset upholds a few network choices, for example, Wi-Fi 5, Bluetooth v5.2, GPS (L1CA+L5), BeiDou, Glonass, Galileo, QZSS, NavIC, 4G Transporter Collection, SA/NSA modes. In terms of availability, smartphones equipped with Dimensity 6100+ will be available for purchase in the third quarter of 2023.
To review, MediaTek had presented the Dimensity 6000 series SoCs, for example, Dimensity 6020 and the Dimensity 6080 chipsets recently. Dimensity 6080 is produced using a 6nm process, whereas Dimensity 6020 is a 7nm SoC. Two Cortex-A76 cores and six Cortex-A55 cores make up the Dimensity 6020 SoC, while the Dimensity 6080 has two Cortex-A76 cores and six Cortex-A55 cores. Both these chipsets have MediaTek HyperEngine 5.0 gaming innovation support, double 5G SIM backing, and they can be matched with LPDDR4x Smash and UFS 2.2 capacity.
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Dimensity 6100+ Chipset Expected Smartphones To Launch
The rundown of cell phones that will make a big appearance with the MediaTek Dimensity 6100+ chipset is obscure. In any case, online reports recommends that cell phone OEMs will send off telephones fueled by the new Dimensity 6100+ chipset in Q3 2023. We will be paying special attention to the updates and will share the fundamental data once accessible.
| Dimensity 6100+ | Dimensity 6020 | Dimensity 6080 | |
| Process | TSMC N6 (6nm-class) | TSMC N7 (7nm-class) | |
| CPU | 2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz | 2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz | 2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz |
| Memory | LPDDR4x 2133MHz, UFS 2.2 (2-lane) | ||
| Camera | 16MP+16MP, 108MP,Hardware MFNR, 3DNR, AI-FD | 16MP+16MP, 64MP, Hardware MFNR, 3DNR, AI-FD | |
| Display | 2520 x 1080 (Full HD+) at 21:9 120Hz | 2520 x 1080 (Full HD+) at 21:9 90Hz, 120Hz optional | |
| Video Decode / Video Encode | 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps | ||
| Graphics | Mali-G57 MC2 | ||
| Modem | 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA | ||
| Connectivity | Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC |
Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.1, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC |
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Availability
According to the company, the first smartphones with the Dimensity 6100+ SoC will available in the third quarter of 2023. MediaTek Dimensity 6100+ SoC is an exciting new addition to the world of smartphone processors. With its powerful performance and advanced features, this chipset is designed to enhance the user experience and provide seamless multitasking capabilities. The Dimensity 6100+ SoC boasts a high-performance CPU and GPU, allowing for smooth gaming, fast app launches, and efficient power management. It also supports advanced camera features, enabling stunning photography and videography on mobile devices.
This system-on-a-chip offers a range of powerful features and capabilities that will enhance the performance and efficiency of mobile devices. With its advanced AI processing unit, the Dimensity 6100+ SoC can deliver lightning-fast speeds and seamless multitasking. It also supports high-resolution displays and offers impressive gaming performance, making it perfect for gamers and multimedia enthusiasts. Additionally, this chipset incorporates cutting-edge connectivity technologies such as 5G, Wi-Fi 6, and Bluetooth 5.2, ensuring fast and reliable connections.
Conclusion
MediaTek Dimensity 6100+ SoC is the latest offering from MediaTek, a leading semiconductor company. This new system-on-a-chip (SoC) is designed to deliver powerful performance and efficiency for a wide range of devices, including smartphones and tablets. With its advanced architecture and cutting-edge technology, the Dimensity 6100+ offers enhanced processing power, improved graphics performance, and efficient battery management. It also supports advanced connectivity options, such as 5G networks and Wi-Fi 6, allowing users to experience fast and seamless connectivity.
The Dimensity 6100+ SoC is built on a cutting-edge architecture that combines high-performance CPU cores with powerful GPU capabilities, allowing for smooth multitasking and immersive gaming experiences. It also supports advanced AI processing, enabling intelligent features such as facial recognition and voice commands. Furthermore, this SoC incorporates 5G connectivity, providing users with lightning-fast internet speeds and seamless streaming capabilities.
MediaTek Dimensity 6100+ SoC launched FAQ’S
What is the latest Dimensity SoC?
MediaTek officially unveiled the Dimensity 9000 SoC, the world's first 5G chipset based on TSMC's 4 nm process technology with lower power consumption and higher performance.
Is MediaTek Dimensity 8100 Max 5G SoC?
The Mediatek Dimensity 8100 is categorized as an upper mid-range system-on-a-chip (SoC) designed for smartphones. It incorporates a CPU that combines four high-performance ARM Cortex-A78 cores, which can achieve speeds up to 2.85 GHz, with four power-efficient Cortex-A55 cores that can reach speeds of up to 2 GHz. Moreover, this SoC includes a built-in 5G modem that supports all existing standards, including 5G Standalone (SA), and provides a maximum download speed of 4.7 Gbps.
What is the next Snapdragon SoC?
According to reports, the Geekbench single-core and multi-core tests have yielded scores of 1,930 and 6,236 for the Snapdragon 8 Gen 3 SoC. It is anticipated that this forthcoming high-end processor from Snapdragon will be utilized in a majority of the flagship smartphones set to be released in the fourth quarter of 2023 and beyond.
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